全部职位 2024年02月4日
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招聘岗位Seed Engineer Program 2024 - Hardware Development Engineer Intern2024 年种子工程师计划-硬件开发工程师实习生

Seed Engineer program is a six-week summer camp internship experience that combines immersive Amazon peculiar culture, technical courses, hackathon, professional skills training together with practical project experience. The Seed Engineer is to build future Software Development Engineer (SDE) and Hardware Development Engineer (HDE) talents in Asia.
At Amazon, we hire the best minds in technology to innovate and build on behalf of our customers. The intense focus we have on our customers is why we are one of the world’s most beloved brands – customer obsession is part of our company DNA. Our interns write real software and collaborate with a select group of experienced software development engineers (SDEs) who guide interns on projects that matter to our customers.

As a Hardware Development Engineer intern you will engage with an experienced cross-disciplinary staff to conceive and design innovative consumer products. You will work closely with an internal inter-disciplinary team, and outside partners to drive key aspects of product definition, execution, and test. As part of a project team you will support the design, debug, validation and optimization of the products. You will be involved in projects from concept through production, gaining exposure to the complete design lifecycle. You will also support engineering builds gaining experience with high volume manufacturing.
In addition to working on an impactful project, you will have the opportunity to engage with Amazonians for both personal and professional development, expand your network, and participate in activities with other interns throughout your internship. No matter the location of your internship, we give you the tools to own your project and learn in a real-world setting.

To qualify, applicants should be upcoming 3rd year college students (in a 4-year study) and upcoming 2nd year master students (in a 3-year study) with target graduation date in 2026.

Time: 6-week summer camp from July 1st, 2024 to August 9th, 2024

Key job responsibilities
• Learn and become familiar with Amazon hardware development process
• Work closely with Hardware Engineering teams as well as suppliers to support development lifecycle
• Work on a specific project assigned by the business team
• Attend technical trainings and participate in mini-hackathon program
• Other daily tasks assigned by the hiring manager/technical mentor

We are open to hiring candidates to work out of one of the following locations:

Shenzhen, 44, CHN

种子工程师计划是一个为期六周的夏令营实习体验,将沉浸式亚马逊特有文化、技术课程、黑客马拉松、专业技能培训与实践项目经验相结合。种子工程师旨在培养亚洲未来的软件开发工程师(SDE)和硬件开发工程师(HDE)人才
在亚马逊,我们聘请技术领域的精英来代表我们的客户进行创新和构建。我们对客户的高度关注是我们成为世界上最受喜爱品牌之一的原因——客户至上是我们公司 DNA 的一部分。我们的实习生编写真实的软件,并与经验丰富的软件开发工程师(SDE)合作,指导实习生完成对客户重要的项目。
作为一名硬件开发工程师实习生,您将与经验丰富的跨学科团队合作,构思和设计创新的消费产品。您将与内部跨学科团队和外部合作伙伴密切合作,推动产品定义、执行和测试的关键方面。作为项目团队的一员,您将支持产品的设计、调试、验证和优化。您将参与从概念到生产的项目,获得完整设计生命周期的经验。您还将支持工程建设,获得大批量制造的经验。
除了参与有影响力的项目外,您还有机会与亚马逊员工进行个人专业发展方面的交流,扩展您的人脉,并与其他实习生一起参加活动。无论您实习的地点在哪里,我们都会为您提供工具,让您拥有自己的项目并在真实的环境中学习
要获得资格,申请人应为即将进入大学三年级(四年制学习)的学生和即将进入硕士二年级(三年制学习)的学生,目标毕业日期为 2026 年。
时间:2024 年 7 月 1 日至 2024 年 8 月 9 日,为期 6 周的夏令营

主要工作职责
• 学习并熟悉亚马逊硬件开发流程
• 与硬件工程团队以及供应商密切合作,支持开发生命周期
• 从事业务团队分配的特定项目
• 参加技术培训并参与迷你黑客马拉松计划
• 完成招聘经理/技术导师分配的其他日常任务

我们愿意招聘在以下地点工作的候选人:
中国深圳,44

基本任职资格
• Upcoming 3rd year college students (in a 4-year study) and upcoming 2nd year master students (in a 3-year study) with target graduation date in 2026.
• Major in Electrical Engineering, Mechanical Engineering, Computer Science, Electronics, Communication Engineering, Material Science, Photonics or Systems Engineering or related field at time of application.

• 即将进入大学三年级(四年制学习)的学生和即将进入硕士二年级(三年制学习)的学生,目标毕业日期为 2026 年。
• 在申请时主修电气工程机械工程计算机科学电子通信工程、材料科学、光子学或系统工程或相关领域。
• 能熟练使用英语
• Working proficiency in English

优先任职资格
• Previous internship(s) or project experience, if applicable.
• Knowledge of electronic components, design validation, qualification, and analysis
• Learn fast and have a good problem-solving methodology.
• Ability to effectively articulate technical challenges and solutions.
• Adept at handling ambiguous or undefined problems as well as ability to think abstractly.
• Great written and oral communication skills

• 即将进入大学三年级(四年制学习)的学生和即将进入硕士二年级(三年制学习)的学生,目标毕业日期为 2026 年。
• 在申请时主修电气工程机械工程计算机科学、电子、通信工程、材料科学、光子学或系统工程或相关领域。
• 能熟练使用英语
优先任职资格
• 以前的实习或项目经验(如果适用)。
• 具备电子元件、设计验证、鉴定和分析方面的知识
• 学习速度快,有良好的解决问题的方法。
• 能够有效地表达技术挑战和解决方案。
• 擅长处理不明确或不确定的问题,以及抽象思考的能力
• 出色的书面和口头沟通能力

投递链接:亚马逊校招直投

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